What impact will the 5G era have on thermal conductive materials?

What impact will the 5G era have on thermal conductive materials

 

In the industrial background of the unstoppable era of 5G, both the 5G smart device terminal market and the base station field will undergo major performance changes.

In the terminal field, smart phones will face important changes in the 5G era. First, the increase in computing demand will bring about an increase in power consumption. Second, the more compact internal design and non-metallization of the body will become a trend. Both of these changes will give heat conduction Heat dissipation puts forward higher requirements. One of the most notable is the advent of foldable mobile phones. Flexible AMOLED screens have stricter requirements on heat conduction.

 

The traditional thermal conductive material of smart phones-thermally conductive graphite sheet, because the material itself is fragile and wears a large amount, needs to be covered and processed by insulating glue, which can no longer meet the demand.

 

The advent of

 

Our company combines the advantages of independent R & D and production plants, a number of national technical patents and other advantages. The exclusive WT series carbon fiber thermal pads have extremely high thermal conductivity in the vertical direction. 15/


In the field of communication base stations, as of the end of February this year, China Unicom has opened 64,000 5G base stations. In the case of China's collective efforts to fight against the epidemic and clearing a number of data, the 5G project postponed due to the epidemic will accelerate the landing. Unicom and Telecom will strive to complete the construction target of 250,000 base stations in the first three quarters of the year. The China Mobile will build 300,000 5G base stations by the end of this year. The superposition of massive computing requirements and Massive MIMO technology increase the power consumption of a single base station and bring higher challenges to the heat conduction and cooling system.

Heat dissipation is a problem that must be overcome for the normal operation of electronic equipment. In the era of the 5G era, thermal conductivity materials have ushered in a new wave of challenges and opportunities. Our company actively develops and builds thermal conductive materials with independent brands and intellectual property rights, provides better products and services to helps the 5G industry chain flourish.

 

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