How does the high-speed optical module dissipate heat?
What are the material choices for high-speed optical module heat dissipation
The optical module is composed of optoelectronic devices, functional circuits and optical interfaces, etc. The optoelectronic device includes two parts: transmitting and receiving. The function of the optical module is photoelectric conversion. The transmitting end converts the electrical signal into an optical signal. After transmission through the optical fiber, the receiving end converts the optical signal into an electrical signal.
With the 5G network construction, AR / VR interactive experience, 8K ultra-high-definition video transmission, cloud computing, Internet of Things, Internet of Vehicles, AI and other technologies have continuously made breakthroughs and developments, and global data traffic has continued to rise. Data centers have moved from 100G to
As a midstream product, there are optical and electrical core chips in the optical module industry, and there are large customers such as cloud manufacturers or telecommunications equipment vendors. The pressure on the cost side is high, the technology update iteration is fast, and the outstanding quality and performance can stand out.
The heat source of the optical module is mainly located near the PCB chip and the optical devices (TOSA and ROSA). The main difficulty of the motherboard chip heat dissipation is that when the mother board or the single board, the component with large heat generation is located on the bottom, the heat generated by the chip cannot be transferred to the main unit
Waermtimo developed the new TIM WT5912-H25-40 high-strength thermal conductive
WT 5902-D45 thermal pad can solve the problem of product structure design tolerance changes and can be reused. It is a
In 2020, optical modules are also one of the few industries that are not affected by the epidemic but benefit from the new infrastructure policy, and are ushering in their own highlight moments.
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